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TECHNICAL NOTE
High-performance Regulator IC Series for PCs
Ultra Low Dropout Linear Regulators for PC Chipsets
BD3506F, BD3506EFV
Description The BD3506F/EFV is an ultra-low dropout linear regulator for chipset that can achieve ultra-low voltage input to ultra-low voltage output. By using N-MOS FET for built-in power transistor, the regulator can be used at ultra-low I/O voltage difference up to voltage difference generated by ON resistor (Ron = 120 m/100 m). Because by reducing the I/O voltage difference, large current (Iomax = 2.5A) output is achieved and conversion loss can be reduced, switching power supply can be replaced. BD3506F/EFV does not need any choke coil, diode for rectification and power transistor which are required for switching power supply, total cost of the set can be reduced and compact size can be achieved for the set. Using external resistors, optional output from 0.65V to 2.5V can be set. In addition, since voltage output start-up time can be adjusted by using the NRCS terminal, it is possible to meet the power supply sequence of the set.
Features 1) Built-in high-accuracy reference voltage circuit (0.65V1%) 2) Built-in VCC low input maloperation prevention circuit (Vcc = 4.15V) 3) Reduced rush current by NRCS 4) Built-in ultra-low on-resistor (120/100 m typ) Nch Power MOSFET (BD3506F/BD3506EFV) 5) Built-in current limiting circuit (2.5A min) 6) Built-in thermal shutdown circuit 7) Output variable type (0.65-2.5V) 8) Adoption of SOP8 package (BD3506F): 5.0 x 6.2 x 1.5 (mm) 9) Adoption of high power HTSSOP-B20 package (BD3506EFV): 5.0 x 6.4 x 1.0 (mm)
Applications Mobile PC, desktop PC, LCD-TV, DVD, digital home appliances
Line up Parameter Ron Output Current Package
BD3506F 120m 2.5A SOP8
BD3506EFV 100m 2.5A HTSSOP-B20
Oct. 2008
ABSOLUTE MAXIMUM RATINGS
BD3506F ABSOLUTE MAXIMUM RATINGS(Ta=25) Parameter Input Voltage1 Input Voltage2 Enable Input Voltage Power Dissipation1 Power Dissipation2 Operating Temperature Range Storage Temperature Range Maximum Junction Temperature Symbol VCC VIN Ven Pd1 Pd2 Topr Tstg Tjmax BD3506F 7* 7* 7 560 * 690 *
2 3 1 1
BD3506EFV 7* 7* 7 1000 *
4 1 1
Unit V V V mW mW
-10+100 -55+125 +150
-10+100 -55+125 +150
*1 However, not exceeding Pd. *2 In the case of Ta25C (no heat radiation board), derated at 4.48 mW/C. *3 In the case of Ta25C (when mounting to 70mmx70mmx1.6mm glass epoxy substrate), derated at 5.52 mW/C. *4 In the case of Ta25C (when mounting to 70mmx70mmx1.6mm glass epoxy substrate), derated at 8.00 mW/C.
RECOMMENDED OPERATING CONDITIONS BD3506F/EFV RECOMMENDED OPERATING CONDITIONS(Ta=25) Parameter Input Voltage1 Input Voltage2 Output Voltage Enable Input Voltage Capacitor in NRCS pin Symbol VCC VIN Vo Ven CNRCS MIN 4.3 1.2 VFB -0.3 0.001 MAX 5.5 VCC-1 * 2.5 5.5 1
5
Unit V V V V uF
*5 However, irrespective of charging order of VCC and VIN. * No radiation-resistant design is adopted for the present product.
2/16
ELECTRICAL CHARACTERISTICS BD3506F/BD3506EFV ELECTRICAL CHARACTERISTICS (unless otherwise noted, Ta=25 VCC=5V Ven=3V VIN=1.8V R1=3.9K Standard Value Parameter Symbol MIN TYP MAX Bias Current ICC 0.7 1.4 Bias current IST 0 10 Shut-Down Mode Current VOUT 1.200 Output Voltage Io 2.5 Maximum Output Current Iost 2.0 Maximum Short Current Tcvo 0.01 Temperature coefficient of Output VFB1 0.643 0.650 0.657 Voltage Feed Back Voltage 1 VFB2 0.630 0.650 0.670 Feed Back Voltage 2 Reg.l1 0.1 0.5 Line Regulation 1 Reg.l2 0.1 0.5 Line Regulation 2 Reg.L 0.5 10 Dropout Voltage (BD3506F) dVo 120 200 Dropout Voltage (BD3506EFV) dVo 100 160 Standby Discharge Current Iden 150 [Enable] High level Enable Input Voltage Enhi 2 5.5 Low level Enable Input Voltage Enlow -0.3 0.8 Enable pin Input Current Ien 7 10 [Voltage Feed Back] Feed Back terminal Bias Current IFB -100 0 100 [NRCS] NRCS Charge Current Inrcs 14 20 26 NRCS Standby Voltage VSTB 0 50 [UVLO] VCC UVLO VCCUVLO 4.00 4.15 4.30 VCC UVLO Hysterisis Vcchys 100 160 220
*5 Design Guarantee
R2=3.3K) Unit mA uA Ven=0V V Io=50mA A A Vo=0V %/ V V %/V %/V mV mV mV mA V V uA nA uA mV V mV Vnrcs=0.5V Ven=0V Vcc:Sweep-up Vcc:Sweep-down Io=50mA Io=0 to 2A, Ta=-10 to 100 *5 VCC=4.3V to 5.5V VIN=1.2V to 3.3V Io=0 to 2A Io=1A,VIN=1.2V, Ta=-10 to 100 *5 Io=1A,VIN=1.2V, Ta=-10 to 100 *5 Ven=0V, Vo=1V Condition
Ven=3V
3/16
Reference Data
10
Vout (50mV/div)
EN
8
Vin
IIN(uA)
6 4 2 0 0 2 4 VIN(V) 6 8
Vcc Iout (1A/div) Vo
Fig.1 Transient Response
Fig.2 Input Voltage SequenceFinal Input Voltage EN
656 655 654
Fig.3 VIN-IIN(Ta=25)
EN Vin
Vfb(mV)
EN Vin
653 652 651 650 649
Vcc
Vcc
Vo
648 647 646 -10 10 30 50 Ta( ) 70 90
Vo
Fig.4 Input Voltage SequenceFinal Input Voltage VIN
Fig.5 Ta-Vfb
Fig.6 Input Voltage SequenceFinal Input Voltage VCC
18 16
Vo 20mV/DIV
Vo 20mV/DIV
IEN(uA)
14 12 10 8 6 4 2 0 0 1 2 3 VEN(V) 4 5
Io 1A/DIV
Io 1A/DIV
Fig.7 Transient Response (rise) Cout=100uF
Fig.8 Transient Response (fall) Cout=100uF
Fig.9 VEN-IEN
Vo 20mV/DIV
EN 2V/DIV NRCS 0.5V/DIV
EN 2V/DIV NRCS 0.5V/DIV Vo 0.5V/DIV
Io 1A/DIV
Vo 0.5V/DIV
Fig.10 Transient Response (rise) Cout=220uF
Fig.11 Start up Wave Form
Fig.12 Shut down Wave Form
4/16
700 600 500 VFB(mV) 400 300 200 100 0 0 0.2 0.4 0.6 0.8 VNRCS(V) 1 1.2
Vo 20mV/DIV
Vo 50mV/DIV
Io 1A/DIV
Io 1A/DIV
Fig.13 VNRCS-VFB
Fig.14 Transient Response (fall) Cout=220uF
Fig.15 Transient Response (rise) 47u MLCC+30m
Vo 50mV/DIV
Io 1A/DIV
Fig.16 Transient Response (fall) 47u MLCC+30m
5/16
BLOCK DIAGRAM BD3506F VCC
4
VCC VCC
Enable
EN 1
Reference Block
UVLO
CL
Current Limit
VIN 2 VIN
Vo1 7 CL UVLO TSD 8 EN 3 NRCS TSD 6 NRCS 5 GND R1 Vo2 VFB R2 Vo
Thermal Shutdown
BD3506EFV
VCC
17
VCC VCC VIN1 UVLO VCC 5 6 7 CL UVLO TSD NRCS 4 NRCS 2 GND 3 20 8 EN 9 10 16 CL Current Limit 14 15 VIN2 VIN
EN 13
Reference Block
Vo1 Vo2 Vo3 Vo4 Vo5 Vo6 FB R1 R2 Vo
Thermal Shutdown TSD
6/16
BD3506F PIN CONFIGRATION
PIN FUNCTION PIN No. PIN NAME 8 VO2 7 VO1 6 NRCS 5 GND 1 2 3 4 5 6 EN VIN FB VCC GND NRCS VO1 VO2
PIN FUNCTION Enable Pin Input Voltage Pin Output Voltage Feedback Power Source Ground Pin NRCS(Non Rush Current on Start Up) time setup VO1 Pin VO2 Pin
EN 1 VIN 2 FB 3 VCC 4
7 8
BD3506EFV PIN CONFIGRATION
PIN FUNCTION PIN No. 1 PIN NAME N.C. GND1 GND2 NRCS VO1 VO2 VO3 VO4 VO5 VO6 N.C. N.C. EN VIN1 VIN2 FB VCC N.C. N.C. GND3 PIN FUNCTION Non connection Ground1 Pin Ground2 Pin NRCS(Non Rush Current on Start Up) time setup VO1 Pin VO2 Pin VO3 Pin VO4 Pin VO5 Pin VO6 Pin Non connection Non connection Enable Pin Input Voltage1 Pin Input Voltage2 Pin Output Voltage Feedback Power Source Non connection Non connection Ground3 Pin
N.C. 1 GND1 2 GND2 3 NRCS 4
20 GND3 19 N.C. 18 N.C. 17 VCC 16 FB 15 VIN2 14 VIN1 13 EN 12 N.C. 11 N.C.
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
VO1 5 VO2 6 VO3 7 VO4 8 VO5 9 VO6 10
7/16
Block Function AMP An error amplifier that compares reference voltage (VREF) to Vo and drives Nch FET (Ron = 120/100 m) of output. The frequency characteristics are optimized so that low ESR functional polymer capacitor can be used for the output capacitor and high-speed transient response can be achieved. The input voltage range at the AMP section is GND-2.5V and the output voltage range of the AMP section is GND-VCC. At the time of EN OFF or UVLO, the output is brought to the LOW level and the output NchFET is turned OFF. EN By the logic input pin, regulator ON/OFF is controlled. At the time of OFF, the circuit current is controlled to be 0 A to reduce the standby current consumption of the apparatus. In addition, EN turns ON FET that can discharge NRCS terminal Vo and removes excess electric charge to prevent maloperation of IC on the load side. Since there is no electrical connection with the Vcc terminal as is the case of Di for electrostatic measures, it does not depend on the input sequence. UVLO UVLO turned OFF output to prevent output voltage from making maloperation at the time of Vcc reduced voltage. Same as EN, UVLO discharges NRCS Vo. When voltage exceeds the threshold voltage (TYP 4.15V), UVLO starts output. CURRENT LIMIT In the event the output current that exceeds the current (2.5A or more) set inside the IC flows when output is turned ON, output voltage is attenuated to protect the IC on the load side. When current reduces, output voltage returns to the set voltage. NRCS Connecting an external capacitor to the counter-GND of NRCS pin can achieve soft start. The output voltage startup time is determined by the time when the NRCS terminal reaches VFB (0.65V). During start-up, the NRCS terminal serves as a constant current source of 20 uA (Typ.) output, and charges the capacitor externally connected. TSD (Thermal Shut down) In order to prevent thermal breakdown and thermal runaway of the IC, the output is turned OFF when chip temperature becomes high. In addition, when temperature returns to the specified temperature, the output is recovered. However, since the temperature protection circuit is originally built in to protect the IC itself, thermal design within Tj(max) is requested. VIN This is a large-current supply line. The VIN terminal is connected to the rain of output NchFET. Since there is no electrical connection with the Vcc terminal as is the case of Di for electrostatic measures, it does not depend on the input sequence. However, because there is body Di of output NchFET between VIN and Vo, there is electrical connection (Di-connection) between VIN and Vo. Consequently, when the output is turned ON/OFF by VIN, reverse current flows from Vo to VIN, to which care must be taken.
8/16
TIMING CHART EN ON/OFF VIN
VCC
EN
NRCS
Start up Time
Vo t VCC ON/OFF VIN
UVLO hysterisis
VCC
EN
NRCS
Start up Time
Vo t
9/16
Evaluation Board BD3506F Evaluation Board Circuit U1 EN 1 VIN Cin1 VCC Ccc BD3506F Evaluation Board Application Components Part No U1 R1 R2 Value 3.3k 3.9k Company ROHM ROHM ROHM Parts Name BD3506F MCR03EZPF3301 MCR03EZPF3901 Part No Ccc Cin1 Co C6 Value 1uF 10uF 220uF 0.01uF Company ROHM ROHM SANYO,etc ROHM Parts Name MCH184CN105K MCH218CN106K 2R5TPE220MF 2 3 4 EN VIN FB VCC BD3506F VO2 VO1 NRCS GND 8 7 6 GND 5 CNRCS R1 Vo CO
R2
BD3506F Evaluation Board Layout Silk Screen TOP Layer Bottom Layer
For Evaluation Board, BD3506EFV is available.
10/16
Recommended Circuits
R2
VOUT(1.2V)/2.5A 1 Ven 2 C2 VIN 3 R1 C4 4 Vcc C1 5 6 7 8 C3 +
Part No R1/R2
Value 6.5k/5.5k voltage setting resistors (R1, R2). VREF bias current (100 nA).
Notes for use The present IC can set output voltage by external reference voltage (VR) and value of output Output voltage can be set by VRxR2/(R1+R2) but it is recommended to use at the resistance value (total: about 10 k) which is not susceptible to
C3
100F
Connect the output capacitor between Vo1, Vo2 terminals and GND terminal without fail in order to stabilize output voltage. The output capacitor has a role to compensate for the phase When of loop gain and to reduce output voltage fluctuation when load is rapidly changed.
there is an insufficient capacity value, there is a possibility to cause oscillation, and when the equivalent serial resistance (ESR) of the capacitors is large, output voltage fluctuation is increased when load is rapidly changed. conditions. About 100-F high-performance electrolytic capacitors are recommended but output capacitor greatly depends on temperature and load In addition, when only ceramic capacitors with low ESR are used, or various Thoroughgoing confirmation at application temperature capacitors are connected in series, the total phase allowance of loop gain becomes not sufficient, and oscillation may result. C1 0.1F and under load range conditions is requested. The input capacitor plays a part to lower output impedance of a power supply connected to input terminals (Vcc). When output impedance of this power supply increases, the input The use of capacitors of about 0.1 F with low ESR, voltages (Vcc,) become unstable and there is a possibility of giving rise to oscillation and degraded ripple rejection characteristics. which provide less capacity value changes caused by temperature changes, is recommended, but since input capacitor greatly depends on characteristics of the power supply used for input, substrate wiring pattern, thoroughgoing confirmation under the application temperature and load range, is requested. C2 10F The input capacitor plays a part to lower output impedance of a power supply connected to input terminals (VIN). When output impedance of this power supply increases, the input The use of capacitors of about 10 F with low ESR, voltages (VIN) become unstable and there is a possibility of giving rise to oscillation and degraded ripple rejection characteristics. which provide less capacity value changes caused by temperature changes, is recommended, but since input capacitor greatly depends on characteristics of the power supply used for input, substrate wiring pattern, thoroughgoing confirmation under the application temperature and load range, is requested. C4 1F To the present IC, there mounted is a function (Non Rush Current on Start-up: NRCS) to prevent rush current from VIN to load and output capacitor via Vo at the output voltage start-up. When the EN terminal is reset from High or UVLO, constant current is allowed to flow from the NRCS terminal. By this current, voltage generated at the NRCS terminal becomes the In order to stabilize the NRCS set time, it is reference voltage and output voltage is started. temperature change.
recommended to use a capacitor (B special) with less capacity value change caused by
11/16
About heat loss In designing heat, operate the apparatus within the following conditions. (Because the following temperatures are warranted temperature, be sure to take margin, etc. into account.) 1. Ambient temperature Ta shall be not more than 100C. 2. Chip junction temperature Tj shall be not more than 150C. Chip junction temperature Tj can be considered under the following two cases. Chip junction temperature Tj is found from Chip junction temperature Tj is found from ambient temperature Ta: IC surface temperature TC under actual Tj=Ta+j-axW application conditions: Reference value Tj=TC+j-cxW Reference value j-a:SOP8 222.0/W (IC only) j-c:SOP8 41.0/W 181.0/W Single-layer substrate HTSSOP-B20 45.0/W (substrate surface copper foil area: less 3%) Substrate size:70x70x1.6mm j-a:HTSSOP-B20 125.0/W Single-layer substrate (Substrate surface capper (substrate surface copper foil area: less 3%)) foil area:less3%) 86.2/W 2nd-layer 2 (substrate surface copper foil area:15x15mm ) j-a:HTSSOP-B20 125.0/W 54.3/W 2nd-layer 86.2/W 2 (substrate surface copper foil area: 70x70mm ) 54.3/W 39.1/W 4th-layer 39.1/W 2 (substrate surface copper foil area: 70x70mm ) Substrate size 70x70x1.6mm3 (thermal vias in the board.) Most of heat loss in BD3506F/EFV occurs at the output Nch FET. The power lost is determined by multiplying the voltage between VIN and Vo by the output current. Confirm voltage and output current conditions of VIN and Vo used, and collate them with the thermal derating characteristics. Because BD3506EFV employs the power PKG, the thermal derating characteristics significantly vary in accord with the pc board conditions. When designing, care must be taken to the size of a pc board to be used. Power dissipation (W) = {Input voltage (VIN) - Output voltage (V0VREF)}xIo (averaged) Ex.) If VIN = 1.8 volts, V0=1.2 volts, and Io (averaged)=1.5 A, the power dissipation is given by the following: Power dissipation (W) =(1.8 volts - 1.2 volts) x 1.5 (A) = 0.9 W EQUIVALENT CIRCUIT
Vcc Vcc 1k 1k
NRCS
1k 1k
VIN
1k
10k 1k Vcc Vcc VFB
10k
1k 100k 100k 20pF
1k Vo1 Vo2 50k 1k
EN 350k
10k
12/16
NOTE FOR USE 1. Input terminals(VCC,VIN,EN) In the present IC, EN terminal, VIN terminal, and VCC terminal have an independent construction. In addition, in order to prevent malfunction at the time of low input, the UVLO function is equipped with the VCC terminal. They begin to start output voltage when all the terminals reach threshold voltage without depending on the input order of input terminals. 2. Operating range Within the operating range, the operation and function of the circuits are generally guaranteed at an ambient temperature within the range specified. The values specified for electrical characteristics may not be guaranteed, but drastic change may not occur to such characteristics within the operating range. 3. Permissible dissipation With respect to the permissible dissipation, the thermal derating characteristics are shown in the Exhibit, which we hope would be used as a good-rule-of-thumb. Should the IC be used in such a manner to exceed the permissible dissipation, reduction of current capacity due to chip temperature rise, and other degraded properties inherent to the IC would result. You are strongly urged to use the IC within the permissible dissipation. 4. Built-in thermal shutdown protection circuit The thermal shutdown circuit is first and foremost intended for interrupt IC from thermal runaway, and is not intended to protect and warrant the IC. Consequently, never attempt to continuously use the IC after this circuit is activated or to use the circuit with the activation of the circuit premised. 5. Inspection by set substrate In the event a capacitor is connected to a pin with low impedance at the time of inspection with a set substrate, there is a fear of applying stress to the IC. Therefore, be sure to discharge electricity for every process. As electrostatic measures, provide grounding in the assembly process, and take utmost care in transportation and storage. Furthermore, when the set substrate is connected to a jig in the inspection process, be sure to turn OFF power supply to connect the jig and be sure to turn OFF power supply to remove the jig. 6. For the present product, thoroughgoing quality control is carried out, but in the event that applied voltage, working temperature range, and other absolute maximum rating are exceeded, the present product may be destroyed. Because it is unable to identify the short mode, open mode, etc., if any special mode is assumed, which exceeds the absolute maximum rating, physical safety measures are requested to be taken, such as fuses, etc.. 7. The use in the strong electromagnetic field may sometimes cause malfunction, to which care must be taken. 8. In the event that load containing a large inductance component is connected to the output terminal, and generation of back-EMF at the start-up and when output is turned OFF is assumed, it is requested to insert a protection diode. (Example) OUTPUT PIN
9. We are certain that examples of applied circuit diagrams are recommendable, but you are requested to thoroughly confirm the characteristics before using the IC. In addition, when the IC is used with the external circuit changed, decide the IC with sufficient margin provided while consideration is being given not only to static characteristics but also variations of external parts and our IC including transient characteristics.
13/16
10. The present IC is a monolithic IC and has P+ isolation between elements to separate elements and a P substrate. With this P layer and N layer of each element, PN junction is formed, and various parasitic elements are formed. For example, when resistors and transistors are connected to terminals as illustrated below, at the resistor, when GND>terminal A, and at transistor (NPN), when GND>terminal B, PN junction works as a parasitic diode. at the transistor (NPN), when GND>terminal B, the parasitic NPN transistor is operated by the N-layer of other element adjacent to the parasitic diode. The parasitic element is inevitably formed because of the IC construction. The operation of the parasitic element gives rise to mutual interference between circuits and results in malfunction, and eventually, breakdown. Consequently, take utmost care not to use the IC to operate the parasitic element such as applying voltage lower than GND (P substrate) to the input terminal.
Resistor PIN A PIN B C NPN Transistor Structure (NPN) B E Parasitic diode GND N P+ N N P substrate N Parasitic diode GND Parasitic diode N P substrate GND Nearby other device Parasitic diode P P+ P+ N N C B E GND P P+ PIN A
GND PIN B
POWER DISSIPATION SOP8
(1) Mounted on board 70mmx70mmx1.6mm Glass-epoxy PCB j-a=181/W (2) Without heat sink j-a=222/W (1) 690mW
HTSSOPB-20
measureTH-156Kuwano-Denki measure conditionRohm Standard Board PCB size70mmx70mmx1.6mmt (PCB with Thermal Via)
PCBSingle-layer substrate PCBDouble-layer substrate
[mW] 700 600 Power Dissipation [Pd] 500
[W] 5 4 Power Dissipation Pd
substrate surface copper foil area 15mmx15mm
PCBDouble-layer substrate
(2) 560mW
3.20W
substrate surface copper foil area 70mmx70mm
PCBFourth-layer substrate
400 300 200 100 0 0 25 50 75 100 125 150 []
100
3
2.30W
substrate surface copper foil area 70mmx70mm
PCBja=125.0/W PCBja=86.2/W
2
1.45W 1.00W
PCBja=54.3/W PCBja=39.1/W
1
0
25
50
75
100
125
Ambient Temperature [Ta]
Ambient Temperature [Ta]
150 []
14/16
Ordering part number
B
BD3506
D
3
5
0
6
F
E
2
Part Number
Package Type
F : SOP8 EFV : HTSSOP-B20
E2 Embossed carrier tape
Package specification
SOP8

Tape Quantity
5.00.2
8 5
Embossed carrier tape 2500pcs E2
(The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand)
6.20.3 4.40.2
1
4
0.150.1 0.1
1.50.1 0.11
1.27 0.40.1
0.3Min.
Direction of feed
1234
(Unit:mm)
Reel
1234
When you order , please order in times the amount of package quantity.
1234
1Pin
1234
1234
Direction of feed
1234
1234
1234
HTSSOP-B20

6.5 0.1
20 11

Tape Quantity
0.5 0.15 1.0 0.2
Embossed carrier tape 2500pcs E2
(The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand)
6.4 0.2 4.4 0.1
Direction of feed
0.325
1
10
1.0Max. 0.85 0.05 0.08 0.05
0.17 +0.05 -0.03 S 0.08 S
0.65
0.2 +0.05 -0.04
1234
Unit:mm)
Reel
1234
When you order , please order in times the amount of package quantity.
1234
1pin
1234
1234
Direction of feed
1234
1234
1234
15/16
16/16
Catalog No.08T437A '08.10 ROHM (c)
Appendix
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM CO.,LTD. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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